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200G QSFP56 SR4
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200G QSFP56 SR4

200G QSFP56 SR4

Part Number: MCQ-5PV38C-5H
Form Factor: QSFP56
Transmitter: VCSEL
Wavelength: 850nm
Electrical Modulation: 4x53.125Gb/s PAM4
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Product Details of200G QSFP56 SR4

Part Number

MCQ-5PV38C-5H

Data Rate

212Gbps

Form Factor

QSFP56

Voltage Supply

3.3V

Transmitter

VCSEL

Receiver

PIN

Wavelength

850nm

Power consumption

5W

Electrical Modulation

4x53.125Gb/s PAM4

Optical Modulation

4x53.125Gb/s PAM4

Connector

MPO-12

Link Length

70m OM3/100m OM4

Protocols

IEEE 802.3cd,QSFP56 MSA,SFF-8665, CMIS 4.0

Case Temperature

0~70 ℃

 

The Macrochip MCQ-5PV38C-5H QSFP56 optical transceiver is designed for use in 200-Gigabit Ethernet links up to 100m over Multi-Mode Fiber. It integrates 4 data lanes in each direction with 4×53Gb/s PAM4 data rate, each lane operating on 850nm wavelength. The 200G QSFP56 SR4 product is compliant with IEEE 802.3cd 200GBASE-SR4. Digital diagnostics functions are available via the I2C interface, as specified by the CMIS 4.0.

 

FAQ

 

Q: Is the 200G QSFP56 SR4 optical module fully compliant with industry standards?

A: Yes, the 200G QSFP56 SR4 strictly adheres to the IEEE 802.3cd 200GBASE-SR4 specification. It supports 4×50G PAM4 modulation over OM3/OM4 multimode fiber, achieving up to 100m transmission with MPO-12 connectors. This ensures seamless compatibility with mainstream 200G switches and data center architectures.

 

About Us

 

Macrochip has developed a series of self-patented silicon photonics chips based on its innovative technologies on high-speed electro-optical modulation and high-efficiency optical coupling, which are featured with a compact package, low cost, low power consumption, and high extinction ratio. Taking the core advantages of self-developed silicon photonics chips as well as other technologies, Macrochip has a comprehensive portfolio for single-mode and multimode optical transceivers covering 25G/100G/200G/400G/800G, which offers solutions for both telecom and datacom.

 

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Our Factory

 

Macrochip invested 350 million RMB to build a 3500 square meter cleanroom facility in Quanzhou, China, which includes over 100 sets of various instruments and equipment. It can perform various processes such as chip testing, die attach or die bonding, wire-bonding, alignment, burn-in, module ASSY, and module testing. Macrochip has an annual production capacity of 200,000 high-speed optical modules.

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