About Us

Macrochip Technology Co., Ltd. is a high-tech corporation dedicated to R&D and manufacturing of silicon photonics chips and optical transceivers for data centers and 5G networks. With the headquarters in Quanzhou, Macrochip also set up branch offices in Beijing Zhongguan Village and Wuhan Optical Valley.

Macrochip was founded in 2020, with a top-notch technical team in China. We have collaborated with overseas clients in Europe, America, Southeast Asia, and other regions, completing orders worth over 60 million US dollars.

Macrochip has developed a series of self-patented silicon photonics chips based on its innovative technologies on high-speed electro-optical modulation and high-efficiency optical coupling, which are featured with a compact package, low cost, low power consumption, and high extinction ratio. Taking the core advantages of self-developed silicon photonics chips as well as other technologies, Macrochip has a comprehensive portfolio for single-mode and multimode optical transceivers covering 25G/100G/200G/400G/800G, which offers solutions for both telecom and datacom.

• Quality Assurance: Our products are manufactured under stringent quality control processes, ensuring reliability and performance. We adhere to international standards such as ISO 9001 certifications, which are a testament to our commitment to quality.

• Patent Support: Macrochip possesses many insightful patents, such as a high alignment efficiency silicon photonics platform and an ultra-high-speed and low-loss photonics integration platform. These patents not only safeguard our intellectual property but also provide our clients with the assurance of using cutting-edge, legally protected solutions.

To produce high-data-rate optical transceivers, we utilize a variety of advanced equipment, including die attachers, wire bonders, optical alignment systems, wafer testers, and module testers.

For die attach, we utilize high-precision die attach machines from internationally renowned brands such as Amicra and MRSI. These machines boast 1-micron placement accuracy and support high-speed AuSn eutectic processes, meeting the demands of precision assembly and high production capacity.

To enhance efficiency and consistency, our production line is equipped with fully automatic wire bonders, which not only improve production efficiency but also ensure stable and reliable bonding.

For optical alignment, even a few microns of deviation can significantly impact module performance. Therefore, we utilize high-precision alignment systems with active alignment technology that can handle complex and changing process requirements and ensure optimal optical performance.

For wafer and module testing, we collaborate with leading automatic test equipment (ATE) manufacturers to develop customized test platforms. These platforms not only meet customer-specific testing requirements but are also compatible with our own chip designs.

In addition, the Manufacturing Execution System (MES) has been fully introduced into the production process to achieve real-time tracking and refined management of production data, ensuring efficient, stable and high-quality output of the manufacturing process.