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QSFP Optical Transceiver
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QSFP Optical Transceiver

QSFP Optical Transceiver

Part Number: MCQ-6PS1CC-5H
Form Factor: QSFP28
Transmitter: SIP
Wavelength: 1310
Electrical Modulation: 4x25.78Gb/s NRZ
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Product Details ofQSFP Optical Transceiver

Part Number

MCQ-6PS1CC-5H

Data Rate

100Gbps

Form Factor

QSFP28

Voltage Supply

3.3V

Transmitter

SIP

Receiver

PIN

Wavelength

1310

Power consumption

4W

Electrical Modulation

4x25.78Gb/s NRZ

Optical Modulation

1x106.25Gb/s PAM4

Onnector

LC

Link Length

500m

Protocols

IEEE 802.3cd,QSFP28 MSA, SFF-8665,SFF-8636

Case Temperature

0~70 ℃

 

The 100G QSFP28 DR1 optical transceiver integrates the transmit and receive path onto one module. On the transmit side, A DSP based gearbox is used to convert 4x25Gbps NRZ signals to 1x50Gbaud PAM4 signal, DSP output the PAM4 signal to laser drivers, which control one EML with 1310nm center wavelengths.The optical signals are coupled into a single-mode fiber through an industry-standard LC connector. On the receive side, 1310nm PAM4 optical receiver data streams is coupled to a PIN PD and PAM4 trans impedance amplifier, DSP convert the PAM4 signal to 4x25G NRZ signal and output to the module electrical interface . This module features a hot-pluggable electrical interface, low power consumption, and 2-wire serial interface.

To explore our full range of QSFP Optical Transceivers-contact our sales team at [sales@macrochip.com.cn] for customized support.

 

FAQ

 

Q: How does the 4W max power consumption benefit high-density deployments?

A: With a maximum power consumption of 4W, the 100G QSFP28 DR1 module reduces energy costs and thermal load in high-density switches. This efficiency aligns with data center sustainability goals and allows seamless integration into existing 100G infrastructure.

 

Our Factory

 

Macrochip invested 350 million RMB to build a 3500 square meter cleanroom facility in Quanzhou, China, which includes over 100 sets of various instruments and equipment. It can perform various processes such as chip testing, die attach or die bonding, wire-bonding, alignment, burn-in, module ASSY, and module testing. Macrochip has an annual production capacity of 200,000 high-speed optical modules.

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